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A grant from DOC-NIST

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant

This NOFO is for covered entities undertaking construction, expansion, or modernization of commercial facilities for semiconductor materials or semiconductor manufacturing equipment. The central documented fit tests are whether the project falls within that facility scope and whether the applicant can demonstrate substantial ability to finance and carry out the work. The program aims to support long-term, economically sustainable growth in the domestic semiconductor industry and U.S. economic and national security. Award amounts, formal evaluation criteria, full application requirements, and the controlling submission workflow should be confirmed in the official NOFO or amendment.

Start here · Eligibility

Check whether your organization qualifies

Answer 5 focused questions in about 60 seconds before investing time in the application.

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1 source-confirmed criterion · No signupReview criteria

Potential award

Not specified

Time remaining

70 days

Application load

Moderate effort

Best next move

Take the eligibility quiz

Apply

Verified against the source on 8/23/2026

Start here

Confirm eligibility

Check your fit in about 60 seconds.

Eligibility requirementsQuestion 1 of 5

About 60 seconds totalInferred criterion

Does your proposed work directly align with Science and Technology and other Research and Development, Equipment?

What does this mean?

Science and Technology and other Research and Development, Equipment

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This is an explainable self-assessment, not a win probability or legal determination. Hard eligibility conflicts are never averaged against softer program-fit signals. Always verify the official notice.

Optional Review source criteria and citations

Nonprofit status

Confirm nonprofit eligibility in the full notice.

Review source ↗

unclear

Geography

Nationwide availability is inferred from the catalog record; confirm the official notice.

Review source ↗

inferred

Organization size

No organization-size limit was captured.

Review source ↗

unclear

Program area

Science and Technology and other Research and Development, Equipment

Review source ↗

inferred

Population served

No specific population was captured.

Review source ↗

unclear

Matching funds

No cost share is indicated.

Review source ↗

confirmed

Registrations

SAM.gov and Grants.gov registration may be required; confirm in the notice.

Review source ↗

inferred

Exclusions

Review the full notice for exclusions and prohibited uses.

Review source ↗

unclear

Grant-writer assessment

Understand the opportunity

Start with the practical interpretation. Open the complete source narrative when you need the underlying detail.

Plain-English explanation

Editorial analysis

What the funder is trying to accomplish

DOC-NIST states that the CHIPS Incentives Program aims to catalyze long-term, economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This NOFO seeks projects to construct, expand, or modernize commercial facilities for semiconductor materials and semiconductor manufacturing equipment.

Editorial analysis

Strong-fit project signals

The project is for construction, expansion, or modernization of a commercial facility for semiconductor materials or semiconductor manufacturing equipment. The applicant is a nonprofit entity, private-sector entity, or a consortium within the covered-entity definition. The applicant can demonstrate substantial ability to finance and construct, expand, or modernize the relevant facility. The proposal can credibly connect the facility project to sustainable growth in the domestic semiconductor industry and to the stated economic and national-security purpose. The evidence does not establish that this is a scored factor.

Editorial analysis

What reviewers may prioritize

Formal review criteria are not included in the supplied evidence. Based on the stated scope and covered-entity definition, likely substantive considerations are project fit with the specified commercial-facility scope and the applicant's demonstrated capacity to substantially finance and execute the facility work. Alignment with domestic semiconductor growth and economic or national-security objectives is relevant to program purpose, but is not documented as a scoring criterion.

Source dossier Read the full official program description

Source-backed synopsis

What this grant funds

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.

For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips.gov.

Read the complete official description ↗

Decision economics

Size the opportunity

Use the source facts below to judge whether the likely return justifies the application effort.

Award range: Not specified
Total program funding: Not specified
Expected awards: Not specified
Geography: National
Cost share: Not indicated
Assistance listing: Not specified

Mission alignment

Compare your program with Science and Technology and other Research and Development, Equipment.

Geographic fit

National

Working plan

Build the application

The generated milestones are planning aids. Only the official notice establishes required dates.

Requirements captured

Other requirements: An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Submission system: Grants.gov
Attachments: CHIPS Application Portal, 2023-NIST-CHIPS-SMME-01, 2023-NIST-CHIPS-SMME-01 Amendment
Contact: Misty L Roosa Management Analyst · apply@chips.gov · 301-975-3007

Official deadline

November 1, 2026

Moderate effort based on requirements currently captured.

October 2, 2026
Confirm eligibility, registrations, partners, and internal approval.
October 11, 2026
Finalize project design, outcomes, and supporting evidence.
October 18, 2026
Draft the narrative and detailed budget.
October 25, 2026
Complete compliance review and collect attachments.
October 30, 2026
Submit early and preserve the confirmation receipt.

05Past behaviorCompare historical awardsHistorical patterns provide context, but do not predict or guarantee future funding decisions.

No licensed historical awards are currently linked to this opportunity.

06Audit trailVerify the evidenceSee where the facts came from, when they were checked, and what has materially changed.

Source record

Source verified means the official record was successfully checked. It does not mean every eligibility or application field has been extracted.

Verification: verified
Source: grants gov
Last checked: 8/23/2026, 8:50:48 AM
Content updated: 8/12/2026, 1:45:11 AM
Review: Automated normalization; not yet expert-reviewed

Open official source ↗

Material changes

8/10/2026
Updated categories.
8/7/2026
Updated application details, categories, cost share required, description, eligibility, eligibility details, important dates, requirements, source citations.
8/6/2026
Updated tracking started.

Verify before applying. Official funder documents control. Derived analysis and preparation dates should not replace the notice.

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Quick answersFrequently asked questionsGet concise answers about CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant.

Is CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant currently open?

Yes, based on the latest source record. The deadline is November 1, 2026, with 70 days remaining. Because funders can amend or extend notices, confirm the date and submission instructions on the official application page. The source was last checked 8/23/2026.

How much funding does CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant provide?

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant lists Not specified per award. The expected number of awards has not been captured, so the award range alone should not be treated as an estimate of competitiveness.

Who can apply to CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant?

Others (see text field entitled "Additional Information on Eligibility" for clarification) Applicants should still complete the eligibility quiz and verify every condition in the official notice; a general fit does not override exclusions or registration requirements.

Does CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant require matching funds?

No cost-share requirement is indicated in the captured source facts. Applicants should still verify the official budget instructions in case an amendment, program track, or specific cost category carries additional conditions.

What should I prepare before applying to CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment Grant?

Moderate effort is expected. The captured requirements include other requirements, submission system, attachments, contact. Start by confirming eligibility and registrations, then work backward from November 1, 2026 using the preparation plan above.